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Rigid PCB |
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SERIAL |
ITEM |
TECHNICAL DATA |
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1 |
Types of Products |
HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board |
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2 |
Layers |
2－26(layers) |
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3 |
Materials |
FR-4 ,CEM-1,CEM-3 Getek,Rogers, Arlon, PTFE, Taconic,Isola,High TG,Aluminium,Halogan-Free |
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4 |
Max Board Size |
450x660mm 18" x 26" |
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5 |
Board Thickness |
0.4mm to 3.2mm |
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6 |
Copper Clad(Max.) |
6 oz(outer)/4 oz(inner) |
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7 |
Min line Width/space |
0.075mm 3mil |
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8 |
Drill Size Mechanical (min) |
0.20mm 8mil |
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9 |
Drill Size Laser(min) |
0.10mm 4mil |
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10 |
PTH Wall Thickness |
0.020mm 0.8mil |
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11 |
PTH dia tolerance |
±0.075mm ±3mil |
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12 |
NPTH hole dia tolerance |
±0.05mm ±2mil |
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13 |
Hole Position Deviation |
±0.05mm ±2mil |
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14 |
Outline Tolerance |
±0.10mm ±4mil |
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15 |
S/M Pitch |
0.08mm 3mil |
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16 |
Insulation Resistance |
1E+12Ω(Normal) |
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17 |
Test Voltage |
50~300V |
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18 |
Aspect ratio |
8：1 |
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19 |
Thermal Shock |
3x10Sec@288 ℃ |
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20 |
Warp and Twist |
≤0.7% |
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21 |
Current breakdown |
10A |
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22 |
Electric Strength |
＞1.3KV/mm |
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23 |
Peel Strength |
1.4N/mm |
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24 |
Solder Mask Abrasion |
≥6H |
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25 |
Flammability |
94V-0 |
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26 |
Impedance Control |
+/-10%(Differential) |
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27 |
Buried Via |
Yes |
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28 |
Blind Via |
Yes |
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29 |
HDI |
2+N+2 4mil Via hole |
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30 |
Surface Finished |
ENIG,ImAg,ImSn,OSP,HASL |
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Flex/Rigid-Flex PCB |
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SERIAL |
ITEM |
TECHNICAL DATA |
|
1 |
Layers |
1 to 4 layers(Flexible Board) |
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2 to 12 layers(Rigid_Flex Board) |
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2 |
Normal Base Materials |
Kapton,PI,PET for Flex |
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FR4 for Rigid |
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3 |
Normal Base Film Thickness |
12.5um to 50um for Flex |
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0.1mm to 3.2mm for Rigid |
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4 |
Normal Coverlay Thickness |
12un to 25um |
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5 |
Normal Adhesive Thickness |
12un to 35um |
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6 |
Base Copper Thickness |
1/2oz. To 1 oz.(RA/ED Copper) |
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7 |
Stiffener Materials |
PI,PET,FR4,SUS |
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8 |
Min.Finished Thicness |
0.075mm/0.025"(Single Sided) |
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0.13mm/0.005"(Double Sided |
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0.31mm/0.012"(4Layers) |
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9 |
Max.Panel Size |
250mmx400mm/9.8"x15.7" |
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10 |
Min.Drill Diameter |
0.15mm/0.006" |
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11 |
Blind or Buried Vias |
Yes for Rigid_Flex Board |
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12 |
Min.Line width/spacing |
0.05mm/0.002" |
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13 |
Min.Bonding Pitch |
0.10mm/0.004"(Center to Center) |
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14 |
Min.SMT Pitch |
0.40mm/0.016"(Center to Center) |
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15 |
Surface Finishing |
Plated soft Gold over Nickel for Ultrassonic Bonding |
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Plated soft Gold over Nickel for Thermalsonicc Bonding |
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Plated selective hard Gold over Nickel for commector |
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ENIG (Electroless Nickel &lmmersion Gold |
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Hot Air Solder Leveling |
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lmmersion Tin |
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Silver lnk or Carbon lnk Printing |
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Organic Soldersbility Preservative (ENTEK) |
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16 |
Solder Mask |
Liquid Photoimageble Solder Mask |
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17 |
Outline Fabrication |
Precision Punching |
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CNC Routing for Rigid part only |
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CNC V-scoring for Rigid part only |
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18 |
General Tolerance |
Min.Hole Diameter Tolerance ±0.05mm |
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Min.Hole Position Tolerance ±0.05mm |
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Min.Pattem Registraion Tolerance ±0.05MM |
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Min. Soler Mask Registraion Tolerance ±0.075mm |
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19 |
Genntal Capabilities |
Min.Annular ring 0.025mm |
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Min.Solder Mask Bridge(LPI) 0.1mm |
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Plated Gold Thickness 0.025um~3um |
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Immersion Gold Thivkness 0.025um~0.1um |
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Twist and Warp : 1% |
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20 |
E-Testing |
Volatge :24V~3000V |
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Continuity :5-100ohms |
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Flying Probe E-tester and AOI available |
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Aluminum PCB |
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SERIAL |
ITEM |
TECHNICAL DATA |
|
1 |
Type |
Aluminium,Copper, and Ceramics |
|
2 |
Surface Fish |
Tin Lead Free,Immersion Gold,Immersion Silver,OSP |
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3 |
Layer Count |
Single,Double,Four layers |
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4 |
Maximum Board Size |
1185mm*480mm |
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5 |
Minimum Board Size |
5mm*5mm |
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6 |
Minimum Trace Width and Spacing |
0.1mm |
|
7 |
Bowst and Warpage |
≤0.5% |
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8 |
Thickness |
0.3-5.0mm |
|
9 |
Copper Foil Thickness |
35um-240um |
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10 |
Outline or Profile Tolerance |
±0.15mm |
|
11 |
V-CUT Registration Tolerance |
±0.1mm |
|
12 |
Monthly Output |
7000m2 |
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13 |
Hole Location Tolerance |
±0.076mm |
|
14 |
Outline or Profile Process Method |
CNC or Mould Punch |
